JOURNAL OF LIGHT INDUSTRY

CN 41-1437/TS  ISSN 2096-1553

高频低损耗软磁复合材料的研究进展

吴深 李杰超 王晓威 刘建秀 肖艳秋 王辉 高红霞

吴深, 李杰超, 王晓威, 等. 高频低损耗软磁复合材料的研究进展[J]. 轻工学报, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
引用本文: 吴深, 李杰超, 王晓威, 等. 高频低损耗软磁复合材料的研究进展[J]. 轻工学报, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
WU Shen, LI Jiechao, WANG Xiaowei, et al. Development of high-frequency low-loss soft magnetic composites[J]. Journal of Light Industry, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
Citation: WU Shen, LI Jiechao, WANG Xiaowei, et al. Development of high-frequency low-loss soft magnetic composites[J]. Journal of Light Industry, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009

高频低损耗软磁复合材料的研究进展

    作者简介: 吴深(1987-),男,河南省周口市人,郑州轻工业大学讲师,博士,主要研究方向为软磁复合材料.;
  • 基金项目: 河南省科技攻关计划项目(192102210033);郑州轻工业大学博士科研基金资助项目(2014BSJJ022)

  • 中图分类号: TB383.1;TM271.2

Development of high-frequency low-loss soft magnetic composites

  • Received Date: 2020-05-06

    CLC number: TB383.1;TM271.2

  • 摘要: 从软磁复合材料的磁性基体设计、绝缘包覆处理和新型制备技术3个方面对软磁复合材料的研究现状进行综述,得出:磁性基体设计时通过对不同特性的磁粉进行性能互补或对基体形态进行控制都可以有效地提高软磁复合材料的密度和磁导率;经绝缘包覆处理可以提高软磁复合材料的电阻率,从而降低其涡流损耗,但是非磁性相绝缘材料的加入会导致复合材料磁导率和饱和磁化强度降低;采用等离子烧结、微波烧结、激光烧结等新型制备技术可以有效改善软磁复合材料的性能.目前软磁复合材料的综合性能已无法满足电子元器件高频化、微型化的发展需求,未来应将研究重点放在优化基体成分设计与粒度配合、开发新的绝缘包覆材料、创新制备工艺、优化制备工艺参数、完善现有理论模型等方面.
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  • 收稿日期:  2020-05-06
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吴深, 李杰超, 王晓威, 等. 高频低损耗软磁复合材料的研究进展[J]. 轻工学报, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
引用本文: 吴深, 李杰超, 王晓威, 等. 高频低损耗软磁复合材料的研究进展[J]. 轻工学报, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
WU Shen, LI Jiechao, WANG Xiaowei, et al. Development of high-frequency low-loss soft magnetic composites[J]. Journal of Light Industry, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009
Citation: WU Shen, LI Jiechao, WANG Xiaowei, et al. Development of high-frequency low-loss soft magnetic composites[J]. Journal of Light Industry, 2020, 35(5): 61-70. doi: 10.12187/2020.05.009

高频低损耗软磁复合材料的研究进展

    作者简介:吴深(1987-),男,河南省周口市人,郑州轻工业大学讲师,博士,主要研究方向为软磁复合材料.
  • 1. 郑州轻工业大学 机电工程学院, 河南 郑州 450002;
  • 2. 河南坤华同盛建设工程有限公司, 河南 南阳 473000
基金项目:  河南省科技攻关计划项目(192102210033);郑州轻工业大学博士科研基金资助项目(2014BSJJ022)

摘要: 从软磁复合材料的磁性基体设计、绝缘包覆处理和新型制备技术3个方面对软磁复合材料的研究现状进行综述,得出:磁性基体设计时通过对不同特性的磁粉进行性能互补或对基体形态进行控制都可以有效地提高软磁复合材料的密度和磁导率;经绝缘包覆处理可以提高软磁复合材料的电阻率,从而降低其涡流损耗,但是非磁性相绝缘材料的加入会导致复合材料磁导率和饱和磁化强度降低;采用等离子烧结、微波烧结、激光烧结等新型制备技术可以有效改善软磁复合材料的性能.目前软磁复合材料的综合性能已无法满足电子元器件高频化、微型化的发展需求,未来应将研究重点放在优化基体成分设计与粒度配合、开发新的绝缘包覆材料、创新制备工艺、优化制备工艺参数、完善现有理论模型等方面.

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