LIU Mao-quan and YANG Ai-fen. Thermal design of a solid state power amplifier module[J]. Journal of Light Industry, 2013, 28(1): 105-108. doi: 10.3969/j.issn.2095-476X.2013.01.025
Citation:
LIU Mao-quan and YANG Ai-fen. Thermal design of a solid state power amplifier module[J]. Journal of Light Industry, 2013, 28(1): 105-108.
doi:
10.3969/j.issn.2095-476X.2013.01.025
Thermal design of a solid state power amplifier module
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Received Date:
2012-09-24
Available Online:
2013-01-15
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Abstract
A solid state power amplifier module was designed.The two thermal components with power amplifier module and power supply module were independently fixed two opposite cooling radiators. According to the thermal quantity,the height of cooling tooth was adjusted, and the cabinet was constructed a wind path by the fans of its both sides. On the base of the structure design, theoretical calculation was used to verify, and the software of Icepak was used to analyse the simulation thermal model, and the test result showed the feasibility.
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Proportional views
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