聚酰亚胺封装体性质预测

杨红军; 屈芳升; 杨坤

doi:10.3969/j.issn.2095-476X.2013.01.012

January 2013

Article Contents

YANG Hong-jun, QU Fang-sheng and YANG Kun. Properties prediction of polyimide packaging body[J]. Journal of Light Industry, 2013, 28(1): 50-52,56. doi: 10.3969/j.issn.2095-476X.2013.01.012

Citation: YANG Hong-jun, QU Fang-sheng and YANG Kun. Properties prediction of polyimide packaging body[J]. Journal of Light Industry, 2013, 28(1): 50-52,56. doi: 10.3969/j.issn.2095-476X.2013.01.012 shu

Properties prediction of polyimide packaging body

Depetment of Technology and Physics, Zhengzhou University of Light Industry, Zhengzhou 450002, China;
Department of Physics, He'nan Polytechnic, Zhengzhou 450046, China

Received Date: 2012-06-27
Available Online: 2013-01-15

Abstract

Seven packaging bodies of PI have been designed and a series of geometric optimization, energy optimization and molecular dynamics optimization of which is carried out by MS 3.0 software. The amorphous structure, parameters of cell, final density, cohesive density and solution parameter of PI packaging bodies are predicted by the analysis module of MS 3.0 software. The results of simulation illustrated that the density of PI packaging bodies is similar and the maximum error is 1.9%, which reduces 11.5% than the first; The cohesive solution parameters are less than theoretic value of PI; In the process of molecule dynamics simulation, bond length and angle versus time are almost unchanged; The results of radial distribution function demonstrate that there is a amorphous structure of having short-range order but without long-range order for PI, which is close to real PI thin film and is used to further simulation and calculation.
- polyimide (PI),
- molecular simulation,
- packaging body
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通讯作者: 陈斌, bchen63@163.com

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沈阳化工大学材料科学与工程学院沈阳 110142

Properties prediction of polyimide packaging body

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References

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通讯作者: 陈斌, bchen63@163.com