Research on transient short-circuit failure analysis and finite element thermoelectric coupling model of IGBT

Abstract

Keywords:
• insulated gate bipolar transistor (IGBT),
• transient short-circuit junction temperature meaurement,
• critical energy,
• finite element thermoelectric coupling model,

References

1. [1]

   李武华,陈玉香,罗皓泽,等.大容量电力电子器件结温提取原理综述及展望[J].中国电机工程学报,2016,36(13):3546.
   

2. [2]

   汪波,罗毅飞,张烁,等.IGBT极限功耗与热失效机理分析[J].电工技术学报,2016,31(12):135.
   

3. [3]

   SONG Y,WANG B.Survey on reliability of power electronic systems[J].IEEE Transactions on Power Electronics,2013,28(1):591.

4. [4]

   徐帅,杨欢,王田刚,等.电力电子变换器可靠性研究[J].北京交通大学学报(自然科学版),2015,39(5):125.
   

5. [5]

   WU R,BLAABJERG F,WANG H,et al.Catastrophic failure and fault-tolerant design of IGBT power electronic converters-an overview[C]//IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society,Vienna:IEEE,2013:507-513.

6. [6]

   赖伟,陈民铀,冉立,等.老化实验条件下的IGBT寿命预测模型[J].电工技术学报,2016,31(24):173.
   

7. [7]

   LEFEBVRE S,KHATIR Z,SAINT-EVE F,et al.Experimental behavior of single-chip IGBT and CoolMOS devices under repetitive short-circuit conditions[J].IEEE Transactions on Electron Devices,2005,52(2):2763.

8. [8]

   汪波,胡安,唐勇,等.IGBT电压击穿特性分析[J].电工技术学报,2011,26(8):145.
   

9. [9]

   窦智峰,翟朝伟,崔光照,等.IGBT现场失效短路结温测量方法研究[J].轻工学报,2017,32(4):73.
   

10. [10]

    AMMOUS A,AMMOUS K,MOREL H,et al.Electro-thermal modeling of IGBTs:application to short-circuit conditions[J].IEEE Transactions on Power Electronics,2000,15(4):778.

11. [11]

    RACITI A,MUSUMECI S,CRISTALDI D.Modeling and simulation of IGBT thermal behavior during a short circuit power pulse[C]//2015 International Conference on Clean Electrical Power (ICCEP),Taormina:IEEE,2015:542-547.

12. [12]

    CLEMENTE S.Transient thermal response of power semiconductors to short power pulses[J].IEEE Transactions on Power Electronics,1993,8(4):337.

13. [13]

    唐云宇,林燎源,马皓.一种改进的并联IGBT模块瞬态电热模型[J].电工技术学报,2017,32(12):88.
    

14. [14]

    唐勇,汪波,陈明.IGBT开关瞬态的温度特性与电热仿真模型[J].电工技术学报,2012,27(12):146.
    

15. [15]

    SANO K,HAYASHI K,KAWAFUJI H,et al.Ultra-small compact transfer molded package for power modules[C]//200858th Electronic Components and Technology Conference,Lake Buena Vista:IEEE,2008:1832.

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